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 MCC
Micro Commercial Components
TM
omponents 20736 Marilla Street Chatsworth !"# $
% !"#
MLESD08A-2510
Features
* ESD protection for high speed data lines to IEC61000-4-2 ESD contact discharge typical 8KV, max 15KV IEC61000-4-2 ESD air discharge typical 15KV, max 25KV Multilayer structure Surface mount Extremely low capacitance Very low leakage current Fast response time Bi-directional ESD protection Lead free solder termination The best ESD protection for high frequency, low voltage applications
Multilayer Polymer ESD Suppressor
2510
* * * * * * * *
Application
* * * * * * * High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) Display Port Interface Unified Display Interface (UDI) MDDI Ports Gigabit Ethernet USB2.0 and IEEE1394 interface
Suggested Solder Pad Layout
E G
* Caution: This component is designed for signal line protection only, not intended to be used under bias, not for application with a power line.
Environmental Specifications
* * * * * * Operation temperature: -40~90 Moisture Resistance, Steady state: MIL-STD-833,Method 1004.7, 85% RH,85 ,1000hrs Thermal Shock: MIL-STD-202,Method 107G,-55 to150 ,30 min cycle,10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2hrs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @40 , 3 solutions(H2O,
detergent solution, deluxer )
F K J
H
I
DIMENSIONS
Solder leach resistance and terminal adhesion: Per EIA-576 test
DIM A B C D E F G H I J K
INCHES MIN MAX .096 .100 .035 .043 . 013 . 017 .010 .018 .00 8 . 0 12 .022 .026 .014 .018 .018 .022 .018 .022 .014 .010 .055 .063
MM
MIN 2.45 0.90 0.33 0.25 0.2 0 0.55 0.35 0.45 0.45 0.25 1.40
MAX 2.55 1.10 0.43 0.45 0.3 0 0.65 0.45 0.55 0.55 0.35 1.60
NOTE
Revision: 1
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MLESD08A-2510
Electrical Characteristics
Electrical Characteristics
MCC
Micro Commercial Components
TM
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Continuous operating voltage
VDC
---
---
---
8
V
Trigger voltage
VT
IEC61000-4-2 8KV contact discharge
---
300
---
V
Clamping voltage
VC
IEC61000-4-2 8KV contact discharge
---
15
---
V
Leakage current
IL
8V VDC
---
0.10
10
nA
Capacitance
CP
VR = 0V, f = 1MHz
---
0.15
0.3
pF
Operating Temperature
---
---
-40
---
90
Storage Temperature
---
---
-55
---
150
ESD pulse withstand
Pulses
IEC61000-4-2 8KV contact discharge
2000
---
---
---
Notes: 1, Trigger and clamping voltage measure per IEC 61000-4-2, 8KV contact discharge method
Typical MLESD clamping for +8KV pulse per IEC61000-4-2
Revision: 1
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2009/01/01
MLESD08A-2510
MC C
Micro Commercial Components
TM
Design Recommendations for HDMI
For HDMI Source Device
MLESD08A-2510
For HDMI Sink Device
MLESD08A-2510
Revision: 1
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2009/01/01
MLESD08A-2510
Design Recommendations for Display Port
For Display Port Source Device
MC C
Micro Commercial Components
MLESD08A-2510
TM
For Display Port Sink Device
MLESD08A-2510
Revision: 1
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4 of 6
2009/01/01
MLESD08A-2510
Eye Pattern Test
MC C
Micro Commercial Components
TM
HDMI Port lane was protected with MLESD08A-2510, tested for 2.25G bps
HDMI Port without MLESD08A-2510
HDMI Port with MLESD08A-2510
Circuit diagram
Pin configuration
Pin 1, 2, 4, 5 6, 7, 9,10 3, 8
Identification Input lines Output lines Ground
Revision: 1
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5 of 6
2009/01/01
MCC
Micro Commercial Components
TM
Ordering Information
Device (Part Number)-TP Packing Tape&Reel;3Kpcs/Reel
***IMPORTANT NOTICE*** Micro Commercial Components Corp . reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. ***APPLICATIONS DISCLAIMER*** Products offer by Micro Commercial Components Corp . are not intended for use in Medical, Aerospace or Military Applications.
Revision: 1
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2009/01/01
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